Dicing Accessories suited for your dicing process.

Hub Types

To cut silicon and other common semiconductor wafers to fit all Dicing Saws.

hub blades dicing

e-plated Nickel Blades

To cut silcon soft ceramic, PCBs and other plastic materials to fit 2″ and 4″ flanges.

blades, nicke,l adt, dicing

Sintered Metal Blades

To cut hard materials and thick substrates to fit 2″ and 4″ flanges.

blades, dicing, wafer, saw

Resinoid Blades

Self sharping, the ultimate solution for higher cut quality to fit 2″ and 4″ flanges.

blades, dicing, wafer, saw

Tungsten Carbide TCG Blades

Saw blades for plastic tapes and substrates to fit 2″ and 4″ flanges.

blades, dicing, wafer, saw

Special Blades

Special compositions and special shapes and peripheries fitting 2″ and 4″.

ADT blades dicing wafer

Standard Flanges

Suitable for almost all dicing saws with different outside diameters.

flanges, dicing

Minitron Waterflanges

Water penetration deep into kerf. Optimized water flow for thick substrate.

ULTRON pressure sensitive Tapes/Blue Tapes

The film is mostly based on PVC and silicone free. The dicing tape are offered in different thickness, width and different bond strength.
The Blue Tapes are free of silicone release agents. All tapes are delivered by default on a 100m roll.

In our catalog “Dicing Tape from Ultron” you will find a part of our wide range.

You can’t find the right tape? We will be happy to help.

tape, pressure sensitive, dicing, wafer

ULTRON UV sensitive Tapes

The dicing tapes are based on PVC, PO or PT plastics. Some UV-sensitive films are equipped with an additional antistatic layer.

All films are offered in different thicknesses, widths and bond strength. By default, 100m rolls are delivered.

You can’t find the right tape? We will be happy to help.

More informations in the catalogue ULTRON Tapes.

tape, uv sensitive, dicing, wafer

Temperature sensitive Tapes

The dicing tape is coated on one or both sides. At appropriate temperature, depending on the film properties, the film can be easily and without damage, separated from the cut substrate.

The film is available in different thickness, adhesion and separation temperature (90 – 170 degrees).
Can be used for various substrates, e.g. glass, ceramics and also very thin substrates.

Please contact us, we will be happy to help you.

tapes, temperatur sensitive, dicing, wafer

NIKKA

Hot-melt waxes for fixing substrates as an alternative to tapes, also water-soluble.
For dicing and back sanding applications, also in tape form.

nikka, wax, dicing

Minitron Metall Frames

StSt frames to hold wafers/substrates during dicing and cleaning. All sizes and special shapes. Made in Europe, delivery from stock.

metal, frame, dicing, wafer

Minitron Plastic Frames

Low cost or high-rel. plastsic materials, also conductive. Many sizes. Made in Europe, delivery from stock.

plastic frame, dicing wafer

Minitron Grip Rings/Dicing Rings

For all wafer sizes, production largely in Europe, delivery from stock

Minitron Plastic Cassettes for Wafer Frames

Antistatic plastic. 25 positions locking combs to secure Wafer Frames. Made in Europe.

cassette, plastic, waferframes

Minitron Metal Cassettes for Wafer Frames

Anodize aluminium, 25 positions, locking bar to secure Wafer Frames. On request also for Wafers without Frames.

cassette, metal, waferframes

Other Cassettes

  • for wafers without a frame
  • for Grip Rings
metal, cassette, grip rings, wafer, frames

Possibilties for packaging

Trays for frames

packaging trays for frames

Trays for rings

Packaging trays for rings

Membrane boxes for chips

Packaging membrane boxes for chips

Genex Street Kleen

Dicing additive for reduced surface tension of water and optimal removal of debris in order to get better cut results.

Dicing additive for reduced surface tension of water

NIKKA Wafer Protection for laser applications

prevents condensation of laser steam on wafer surface. Easy removal with hot water.

NIKKA Wafer Protection for laser applications

Additives for the sawing process

Improve the sawing process, higher blade life, reduced chiping, higher feed.

Improve the sawing process