To cut silicon and other common semiconductor wafers to fit all Dicing Saws.
e-plated Nickel Blades
To cut silcon soft ceramic, PCBs and other plastic materials to fit 2″ and 4″ flanges.
Sintered Metal Blades
To cut hard materials and thick substrates to fit 2″ and 4″ flanges.
Self sharping, the ultimate solution for higher cut quality to fit 2″ and 4″ flanges.
Tungsten Carbide TCG Blades
Saw blades for plastic tapes and substrates to fit 2″ and 4″ flanges.
Suitable for almost all dicing saws with different outside diameters.
Water penetration deep into kerf. Optimized water flow for thick substrate.
ULTRON pressure sensitive Tapes/Blue Tapes
The film is mostly based on PVC and silicone free. The dicing tape are offered in different thickness, width and different bond strength.
All tapes are delivered by default on a 100m roll.
ULTRON UV sensitive Tapes
The dicing tapes are based on PVC, PO or PT plastics. Some UV-sensitive films are equipped with an additional antistatic layer.
All films are offered in different thicknesses, widths and bond strength. By default, 100m rolls are delivered.
Temperature sensitive Tapes
The dicing tape is coated on one or both sides. At appropriate temperature, depending on the film properties, the film can be easily and without damage, separated from the cut substrate.
The film is available in different thickness, adhesion and separation temperature (90 – 170 degrees).
Can be used for various substrates, e.g. glass, ceramics and also very thin substrates.
Please contact us, we will be happy to help you.
Hot-melt waxes for fixing substrates as an alternative to tapes, also water-soluble.
For dicing and back sanding applications, also in tape form.
Minitron Metal Wafer Frames
StSt frames to hold wafers/substrates during dicing and cleaning. All sizes and special shapes. Made in Europe, delivery from stock.
Minitron Plastic Cassettes for Wafer Frames
Antistatic plastic. 25 positions locking combs to secure Wafer Frames. Made in Europe.
Minitron Metal Cassettes for Wafer Frames
Anodize aluminium, 25 positions, locking bar to secure Wafer Frames. On request also for Wafers without Frames.
- for wafers without a frame
- for Grip Rings
Possibilties for packaging
Trays for frames
Trays for rings
Membrane boxes for chips
Genex Street Kleen
Dicing additive for reduced surface tension of water and optimal removal of debris in order to get better cut results.
NIKKA Wafer Protection for laser applications
Prevents condensation of laser steam on wafer surface. Easy removal with hot water.
Additives for the sawing process
Improve the sawing process, higher blade life, reduced chiping, higher feed.