Dicing Saws and Machines for Scribing and Breaking, depending on the field of application.

ADT 71XX

ADT 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.

The 7120 / 7130 Dicing System is for a variety of applications such as: Ceramic Substrates & Capacitors; Glass; Automotive Sensors; PZT; Glass on Silicon; LED & LED on PCB Packages; Package Singulation (BGA, QFN); Opto-electronic Components; SAW Filters; Sensors & MEMS; LTCC; IC Wafers

ADT 71XX single-spindel for separating ceramics and other substrates.

ADT 79XX

It’s a dual spindle system model, that double the productivity while maintaining the same current production floor space. This kind of Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Leading Applications: Silicon wafers / discrete devices; Silicon carbide (SiC); MEMS; SAW devices; Glass wafer; Packaging (QFN, LED…)

ADT 7900 Dicing Saw is a dual spindle system which prvides a perfect solution for applications that require a long cut cycle time.

ADT 72XX

The 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. It offers a wide range of advanced automation and process monitoring options.

Applications: Silicon; Glass on Silicon; MEMS; GaAs wafers; Package Singulation (BGA & QFN); LTCC; PCB; Hard Materials

The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.

ADT 72XX Single-Spindel for separating silicon and other substrates.

ADT 8020

The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. It’s a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.

The 8020 operates with the ADT intuitive New graphic User Interface (NUI), and includes two touch-screens.

Applications: Silicon wafers / discrete devices; Silicon carbide (SiC); MEMS; SAW devices; Glass wafer; Packaging (QFN, LED…)

ADT 8020 is a Dicing Saw which has two facing spindles.

Opto System Diamondscriber

This system puts scribe lines on a wafer in order to cleave it into chips at the post process.

This system puts scribe lines on a wafer in order to cleave it into chips at the post process.

Opto System Laserscriber

This machine is the dedicated for the scribing process, installed with 355 nm laser.
Suitable system to scribe the GaN wafer for the preparation to cleave into bars and chips.

Opto System Laserscriber is a suitable system to scribe the GaN wafer for the preparation to cleave into bars and chips.

Opto System LED Breaker

Different kind of machines, cuts a scribed wafer into dice in dicing process.

Opto System Breaker cuts a scribed wafer.